| Weight | 0.120 kg |
|---|
-38%
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Product DescriptionMECHANIC MCN-P08 No-clean Solder Paste Flux Soldering Tin BGA Electric Welding Flux for PCB BGA SMDFeatures :High bond strength, PH value neutral, insulation is strong, welding surface smooth. IC and PCB for no corrosive.Its boiling point only slightly higher than the melting point of the solder.For mobile phones, PC cards and other sophisticated electronic chip-level help welding.SKU: n/a
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