Description
The shape is similar to the butter-like paste.
High bond strength, PH value neutral, insulation resistance, welding surface smooth.
For mobile phones, PC cards and other sophisticated electronic chip-level flux welding.
Advantage：
1, The flux is very effective.
2, IC and PCB not corrosive.
3, Having a boiling point only slightly higher than the melting point of the solder.
Instructions for use：
Welding surface rub before the first article, paint this paste on the welding of copper, tin, iron and other metals,
Then use the iron in molten tin solder connection at the can.
Easy to carry and use this paste is easy, using this cream welding rugged durability,
Easy to weld, quickly clean, good insulation, acidic better.
Applicable to metal soldering general instrumentation, copper, tin and iron.
Widespread use of mobile phones board SMD rework process.
After suitable for mobile phones PCB.BGA / PGA and other SMD rework the help paste, lip tin fast curing low residue smoke degree
Surface insulation resistance value is high should this electronic communication
products for the mobile phone electrical interference is very small.
There are no reviews yet.